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TC35273XB The Toshiba TC35273XB is an integrated circuit featuring a BGA/11* package. It is RoHS3 compliant and has an MSL rating of 1.
Mfr Part #:

TC35273XB

Available from 1 distributors
Mfr Name: Toshiba
Toshiba
The Toshiba TC35273XB is an integrated circuit featuring a BGA/11* package. It is RoHS3 compliant and has an MSL rating of 1.
✓ Total Stock: 2,779 pcs

TC35273XB Available from 1 distributor

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Optech Co.,Limited ✓
Non-Authorised Inventory information
2,779 pcs
On Request
2779 pcs On Request 1 On Request On Request 02+ On Request On Request
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TC35273XB Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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TC35273XB Description

Short technical summary and product information.

The TC35273XB from Toshiba is a specialized integrated circuit. It comes in a BGA/11* package, indicating a Ball Grid Array form factor with specific dimensions or pin configuration details.

 

This component is noted as RoHS3 Compliant, meaning it adheres to restrictions on hazardous substances. It also carries an MSL (Moisture Sensitivity Level) rating of 1, signifying it is not sensitive to moisture and has unlimited shelf life under recommended storage conditions.

 

Further technical specifications, such as operating voltage, temperature range, and specific application details, would typically be found in the manufacturer's datasheet. This part is available from YIC Electronics, with stock information indicating availability from Hong Kong.

TC35273XB Quick Information

Product Type: Integrated Circuit
Canonical Name: TC35273XB Integrated Circuit
Subcategory: Specialty ICs

TC35273XB Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

TC35273XB Features

  • Toshiba TC35273XB integrated circuit.
  • BGA/11* package type.
  • RoHS3 compliant.
  • MSL 1 rating.

TC35273XB Applications

  • Used in specialized integrated circuit applications.
  • Suitable for Toshiba BGA/11* package designs.
  • Applicable in surface-mount technology assemblies.
  • Ideal for compact electronic device integration.

TC35273XB FAQs

3 frequently asked questions generated from this part’s specifications.
What is the package type for the Toshiba TC35273XB?

The Toshiba TC35273XB is supplied in a BGA/11* package.

What is the RoHS status of the TC35273XB?

The TC35273XB is Lead free / RoHS Compliant.

What is the Moisture Sensitivity Level (MSL) for the TC35273XB?

The Moisture Sensitivity Level (MSL) for the TC35273XB is 1.

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