| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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15 pcs
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15 pcs | On Request | 1 | On Request | On Request | N/A | On Request | On Request |
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The SILE SX-SDMAC-2830S-SP is a compact RF transceiver module designed for high-performance wireless connectivity. It integrates IEEE 802.11ac Wi-Fi and Bluetooth v5.0 capabilities, powered by the Qualcomm QCA9377 chipset.
This module supports a maximum PHY data rate of 433Mbps under 11ac VHT80 conditions and features a 1x1 data stream. The host interface is provided via SDIO 3.0 for WLAN and UART for Bluetooth, enabling versatile integration into embedded systems.
Operating within a wide temperature range of -20°C to 85°C, the SX-SDMAC-2830S-SP is suitable for demanding industrial applications. It supports various security protocols including WPA/WPA2/WPA3 and IEEE 802.1X, along with Wi-Fi Direct and WPS 2.0.
The module is packaged with 44 Direct Solder Pads, facilitating robust surface mounting. It is compatible with Linux, Android, and Windows operating systems, making it a flexible choice for diverse product development.
The module supports IEEE 802.11ac/a/b/g/n and Bluetooth v5.0.
The maximum PHY data rate is 433Mbps at 11ac VHT80.
It features SDIO 3.0 for wireless LAN and UART for Bluetooth.
The module operates from -20°C to 85°C.
It supports Linux, Android, and Windows (including Embedded Compact versions and Windows 10/IoT).
The package type is Direct Solder Pads with 44 pins.