| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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13,020 pcs
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13020 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Drain to Source Voltage (Vdss) | |
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| Halogen Free | |
| Input Capacitance (Ciss) (Max) @ Vds | |
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| Rds On (Max) @ Id, Vgs | |
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| Vgs(th) (Max) @ Id |
The Vishay SQJB60EP-T1_GE3 is a dual N-channel Power MOSFET featuring TrenchFET technology and AEC-Q101 qualification. It is designed for automotive applications requiring robust performance and reliability.
This MOSFET boasts a 60V drain-source voltage and a continuous drain current rating of 30A per leg at 25°C case temperature, with a reduced rating of 26A at 125°C. Its low on-resistance is specified as 0.012Ω at 10A drain current and 10V gate-source voltage, and 0.016Ω at 4.5V gate-source voltage. The device operates across a wide temperature range from -55°C to 175°C.
The SQJB60EP-T1_GE3 is housed in a PowerPAK SO-8 Dual package, suitable for surface mounting. This package offers efficient thermal performance with a junction-to-case thermal resistance of 3.1°C/W. The component is lead (Pb)-free and halogen-free, meeting stringent environmental standards.
Key electrical characteristics include a gate charge of 30nC at 10V Vgs and an input capacitance of 1600pF at 25V Vds. The device is 100% R_g and UIS tested, ensuring high quality and reliability for demanding applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.64 | $1.64 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The maximum drain-source voltage is 60V.
It is available in a PowerPAK SO-8 Dual surface-mount package.
The operating junction temperature range is -55°C to 175°C.
The maximum RDS(on) is 12mΩ at Vgs=10V and 16mΩ at Vgs=4.5V.
Maximum continuous drain current is 30A at case temperature 25°C, derated to 26A at 125°C, with pulsed current up to 84A.
Maximum gate charge is 30nC at Vgs=10V.
Junction-to-case thermal resistance is 3.1°C/W (drain), junction-to-ambient is 85°C/W when mounted on a 1-inch square PCB.