| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,200 pcs
|
1200 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
22 pcs
|
22 pcs | On Request | 1 | On Request | On Request | 10/11+ | On Request | On Request |
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| Current | |
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| Prop 65 | |
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The Semikron Danfoss SKM75GB12T4 is a high-performance IGBT module designed for demanding applications. It operates at a voltage of 1200V and can handle currents up to 75A.
This module features advanced IGBT 4 Fast (Trench) chip technology, providing efficient switching performance suitable for frequencies up to 20kHz. The SEMITRANS 2 housing ensures robust mechanical and thermal management.
Key features include an insulated copper baseplate using DBC technology for enhanced reliability and increased power cycling capability. The module also comes with pre-applied High Performance Phase Change Material (HP-PCM) for superior thermal performance, maximizing power output or extending lifetime.
Typical applications for the SKM75GB12T4 include AC inverter drives, UPS systems, and electronic welders. Its robust construction and advanced technology make it a reliable choice for power electronics designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The voltage rating is 1200 V.
The current rating is 75 A.
It uses IGBT 4 Fast (Trench) chip technology.
The housing type is SEMITRANS 2.
The module is suitable for switching frequencies up to 20 kHz.
The SKM75GB12T4-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a phase change material and offers superior thermal performance, which maximizes the module's power output or significantly increases its lifetime. The material is solid at room temperature and starts to flow only after very first operation, spread out and fill the gaps between module and cooler.