SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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1 pcs
|
1 pcs | On Request | 1 | On Request | On Request | NO DC | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Tape & Reel |
The Bergquist SIL-PAD K6 300MMX300MM SHEET is a high-performance thermal interface material designed for efficient heat transfer in electronic applications. This sheet form factor allows for versatile application and cutting to specific sizes.
Key specifications include RoHS3 compliance, indicating adherence to environmental regulations regarding hazardous substances. It also carries an MSL 1 rating, signifying unlimited shelf life under standard conditions and minimal moisture sensitivity during assembly processes. The REACH status is unaffected, further confirming its compliance with global chemical regulations.
This thermal pad is suitable for a wide range of thermal management solutions where reliable heat dissipation is critical. Its properties make it a valuable component in the design and manufacturing of electronic devices requiring thermal control to ensure optimal performance and longevity.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.00 | $2.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The SIL-PAD K6 300MMX300MM SHEET is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is Unaffected.