| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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6,295 pcs
|
6295 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
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The SAC305 is a lead-free solder alloy manufactured by N-A, containing 96.5% tin, 3% silver, and 0.5% copper. This alloy is designed for various soldering applications, including wave, selective, hand, and SMT reflow soldering.
Key features include excellent wetting speed, solderability, and spreading capabilities, along with reduced bridging compared to Sn-Cu alloys. The alloy has a solidus temperature of 217°C and a liquidus temperature of 220°C. It is manufactured using AIM Electropure™ Technology, resulting in reduced dross production and superior wetting and fluidity.
This solder alloy complies with IPC J-STD-006 and is RoHS, REACH, and JEIDA compliant. It is compatible with all existing lead-free compatible equipment, processes, coatings, and flux chemistries, including no-clean and water-soluble electronic grade fluxes. The product has a shelf life of 7 years under proper storage conditions at room temperature.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.54 | $0.54 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The SAC305 solder alloy contains 96.5% tin, 3% silver, and 0.5% copper.
The solidus temperature is 217°C (423°F) and the liquidus temperature is 220°C (428°F).
The SAC305 solder alloy has a shelf life of 7 years under proper storage conditions.
Yes, the SAC305 solder alloy is RoHS3 Compliant.
Yes, the SAC305 solder alloy is REACH Unaffected.
The Moisture Sensitivity Level (MSL) for SAC305 is Level 1.
SAC305 bar solder is compatible with all major brands of no-clean and water-soluble electronic grade fluxes.