| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,813 pcs
|
1813 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Memory Interface | |
| Memory Size | |
| Memory Type | |
| Military Grade | |
| Storage Temperature | |
| Tape & Reel |
The S25FL128SAGBHI300 is a high-capacity flash memory device manufactured by Infineon. It features a 128 Mbit storage capacity and utilizes a Quad SPI interface for fast data transfer. Designed for embedded systems, it offers reliable non-volatile storage with RoHS3 compliance. The device is packaged in a BGA form factor suitable for surface mounting on circuit boards. Its specifications make it suitable for applications requiring high-density memory with fast interface capabilities, such as consumer electronics, industrial equipment, and communication devices.
The BGA package ensures a compact design, enabling integration into space-constrained systems. The device's electrical characteristics include standard voltage operation and compatibility with various system voltages. Its environmental compliance with RoHS3 ensures it meets environmental standards for hazardous substances. The device's form factor and interface make it compatible with a wide range of embedded system designs, providing a robust solution for non-volatile memory needs.
| Qty | Low | High |
|---|---|---|
| 1+ | $4.52 | $4.52 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The S25FL128SAGBHI300 is packaged in a BGA form factor.
The device has a memory size of 128 Mbit.
It uses a Quad SPI interface.
Yes, it is RoHS3 compliant.
It has a Moisture Sensitivity Level of 1 Unlimited.
Yes, it is REACH unaffected.