RT2561ST

The RALINK RT2561ST is an integrated circuit (IC) belonging to the Integrated Circuits (ICs) subcategory. It comes in a QFP (Quad Flat Package) form factor, suitable for various electronic applications. This component is noted for its RoHS3 compliance, indicating adherence to environmental standards regarding hazardous substances. Additionally, it features a Moisture Sensitivity Level (MSL) of 1, which signifies unlimited shelf life under recommended storage conditions, making it robust for handling and assembly processes. The REACH status is marked as unaffected, suggesting compliance with regulations concerning chemical substances in products sold within the European Economic Area.

This IC is designed for integration into systems requiring reliable electronic components. Its QFP packaging facilitates surface mounting, a common practice in modern electronics manufacturing for its efficiency and suitability for automated assembly lines. The RoHS3 compliance is a critical factor for manufacturers aiming to meet global environmental regulations and market demands for greener products. The MSL 1 rating simplifies inventory management and assembly by reducing concerns about premature degradation due to moisture absorption.

While specific electrical or thermal characteristics are not detailed in the provided data, the RT2561ST is identified by its part number and manufacturer, RALINK. Its availability is noted, and it is presented as a component that can be requested for quote, indicating its commercial relevance. The focus on compliance and packaging standards highlights its suitability for a wide range of manufacturing environments and end-use applications where regulatory adherence and material integrity are paramount.