| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
25 pcs
|
25 pcs | On Request | 1 | On Request | On Request | 00+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Connector Type | |
| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Height Above Board | |
| Lead Spacing | |
| Lead Style | |
| Mated Stacking Heights | |
| Mounting Type | |
| Number of Positions | |
| Number of Rows | |
| Pitch |
The Samtec QSH-100-01-H-D-DP-A-K is a differential pair array connector designed for high-density mezzanine board-to-board interconnections. It features 200 positions arranged in 2 rows with a 0.50mm pitch, enabling compact designs. The connector is a female receptacle with surface mount termination, making it suitable for automated assembly processes. Contact finish is gold with 30.0µin thickness, ensuring reliable signal integrity. The connector includes features such as board guide, ground bus (plane), and pick-and-place capability for efficient manufacturing. It supports a range of mated stacking heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, and 25mm, providing flexibility in board spacing. The height above board is 0.128 inches (3.25mm). This connector is part of Samtec's QSH series, known for high-speed differential pair applications. It is RoHS3 compliant (unverified) and has an MSL of 1 (unlimited floor life). The part is commonly used in networking, telecommunications, and data storage equipment where high-density interconnects are required.
| Qty | Low | High |
|---|---|---|
| 24+ | $29.13 | $29.13 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
200 positions.
0.50mm (0.020 inches).
Surface mount.
Gold with 30.0µin thickness.
5mm, 8mm, 11mm, 14mm, 16mm, 19mm, and 25mm.
Board guide, ground bus (plane), and pick-and-place capability.
RoHS3 Compliant (unverified).