| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,730 pcs
|
1730 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type | |
| Storage Temperature | |
| Supplier Device Package | |
| Tape & Reel |
The NXP Semiconductors QN9030THN/001Z is a Bluetooth Low Energy (BLE) System-on-Chip (SOC) designed for RF transceiver applications. This integrated circuit is suitable for various wireless communication systems requiring efficient and reliable data transmission.
The component is designed for surface mounting, utilizing a 40-VFQFN Exposed Pad package, which facilitates integration into compact electronic designs. The device adheres to RoHS3 compliance standards, indicating its suitability for environmentally conscious manufacturing processes.
Key specifications include its package type and mounting method, crucial for PCB layout and assembly. The QN9030THN/001Z is part of NXP Semiconductors' range of RF solutions, aimed at enabling advanced wireless functionalities in a wide array of electronic devices.
| Qty | Low | High |
|---|---|---|
| 1+ | $3.43 | $3.43 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The QN9030THN/001Z comes in a 40-VFQFN Exposed Pad package.
The QN9030THN/001Z is designed for Surface Mount.
The QN9030THN/001Z is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
Yes, the REACH status is Unaffected.