| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
9,000 pcs
|
9000 pcs | On Request | 1 | On Request | On Request | 06+ | On Request | On Request | |
|
3,746 pcs
|
3746 pcs | On Request | 1 | On Request | On Request | 06+ | On Request | On Request | |
|
600 pcs
|
600 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Mounting Type |
The PNX0102AET/N102 is an integrated circuit manufactured by Philips Semiconductors, now NXP. This component is housed in a Ball Grid Array (BGA) package, suitable for surface mount applications.
The part is designated as RoHS3 Compliant, indicating adherence to restrictions on hazardous substances. It also carries a Moisture Sensitivity Level (MSL) of 1, meaning it has unlimited shelf life under recommended storage conditions. The REACH status is noted as unaffected.
This IC is part of the broader category of Transistors - Special Purpose. While specific electrical and operating parameters are not detailed here, its BGA packaging suggests use in applications requiring high-density interconnects and compact designs. The manufacturer, Philips (NXP), is a well-known supplier in the semiconductor industry.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.87 | $1.87 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The package type is BGA.
Packaging methods include Tape & Reel, Cut Tape, Tray, and Tube.
It is RoHS3 compliant.
The MSL is Level 1 (Unlimited).
It is REACH unaffected.