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PM-8909-0-152NSP-TR-01-0-02 The Qualcomm PM-8909-0-152NSP-TR-01-0-02 is a communication module chip designed for consumer electronics. It features a BGA package and surface mount installation.
Mfr Part #:

PM-8909-0-152NSP-TR-01-0-02

Available from 2 distributors
Mfr Name: Qualcomm
Qualcomm
The Qualcomm PM-8909-0-152NSP-TR-01-0-02 is a communication module chip designed for consumer electronics. It features a BGA package and surface mount installation.
✓ Total Stock: 907 pcs
$ Price Range: $0.46

PM-8909-0-152NSP-TR-01-0-02 Available from 2 distributors

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Smaxon Electronics ✓
Non-Authorised Inventory information
786 pcs
On Request
786 pcs On Request 1 On Request On Request 17+ On Request On Request
Rayichip ✓
Non-Authorised Inventory information
121 pcs
On Request
121 pcs On Request 1 On Request On Request On Request On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

PM-8909-0-152NSP-TR-01-0-02 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Installation Type
Mounting Type
Output Current
Storage Temperature
Tape & Reel
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PM-8909-0-152NSP-TR-01-0-02 Description

Short technical summary and product information.

The Qualcomm PM-8909-0-152NSP-TR-01-0-02 is a communication module chip utilized in consumer electronics applications. This component is housed in a BGA (Ball Grid Array) package, facilitating a surface mount installation process.

 

The chip offers standard output current capabilities. Its packaging method is specified as a box, and it is designed for ease of integration into various electronic systems.

 

This communication module chip is part of Qualcomm's product line, known for its contributions to mobile and wireless technologies. The PM-8909-0-152NSP-TR-01-0-02 is engineered to meet the demands of modern electronic devices, providing reliable communication functionalities.

PM-8909-0-152NSP-TR-01-0-02 Quick Information

Product Type: Communication Module Chip
Canonical Name: Qualcomm PM-8909-0-152NSP-TR-01-0-02 Communication Module Chip
Subcategory: Wire to Board

PM-8909-0-152NSP-TR-01-0-02 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

PM-8909-0-152NSP-TR-01-0-02 Estimated Pricing

Qty Low High
1+ $0.46 $0.46

Estimated market price range - modelled values for guidance only, not live distributor offers.

PM-8909-0-152NSP-TR-01-0-02 Features

  • BGA package size for compact design.
  • Surface mount installation for easy assembly.
  • Standard output current for general applications.
  • Packaged in a box for secure handling.
  • RoHS3 compliant and REACH unaffected.

PM-8909-0-152NSP-TR-01-0-02 Applications

  • Suitable for consumer electronics connections.
  • Used in wire-to-board interconnects.
  • Ideal for surface mount electronic assemblies.
  • Applicable in compact BGA package designs.

PM-8909-0-152NSP-TR-01-0-02 FAQs

6 frequently asked questions generated from this part’s specifications.
What is the package size of this connector?

The package size is BGA.

What is the mounting type for this connector?

The mounting type is Surface Mount.

What is the output current rating?

The output current is Standard.

Is this connector RoHS compliant?

Yes, it is RoHS3 compliant.

What is the moisture sensitivity level?

The MSL is 1 Unlimited.

Is this product REACH unaffected?

Yes, it is REACH unaffected.

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