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This TDK Corporation PAH62L23 is a heat sink kit, categorized under accessories for board mount power supplies. It is specifically designed for compatibility with the PH75F and PH100S series of power supplies, providing essential thermal management for these components.
The PAH62L23 meets RoHS3 compliance standards, indicating adherence to regulations concerning hazardous substances. It also features a Moisture Sensitivity Level (MSL) of 1, signifying unlimited usability under standard conditions. The REACH status is unaffected, further detailing its compliance profile.
As an accessory, this heat sink kit plays a crucial role in maintaining optimal operating temperatures for the power supplies it is paired with, contributing to their longevity and performance. Its design is intended to facilitate efficient heat dissipation in various electronic applications.
The PAH62L23 is a heat sink kit.
The PAH62L23 is designed for use with the PH75F and PH100S series power supplies.
Yes, the PAH62L23 is RoHS3 compliant.
The Moisture Sensitivity Level (MSL) for the PAH62L23 is 1.