| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
140 pcs
|
140 pcs | On Request | 1 | On Request | On Request | 709 | On Request | On Request |
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| Contact Finish | |
| Contact Finish Thickness | |
| Features | |
| Height Above Board | |
| Lead Spacing | |
| Mated Stacking Heights | |
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| Pitch |
This 3M Electronic Solutions P08-080HLC-E-G connector is a hermaphroditic, self-mating type designed for mezzanine (board-to-board) applications. It offers 80 positions with a fine pitch of 0.80mm, making it suitable for high-density designs. The connector is designed for surface mount (SMT) termination, facilitating automated assembly processes. It features gold contact plating with a thickness of 8.00µin for reliable conductivity and includes board guide and solder retention features for enhanced mechanical stability during assembly and operation. The height above the board is 8.35mm, with a mated stacking height of 11.5mm, providing specific vertical integration capabilities.
This component is classified under Arrays, Edge Type, Mezzanine (Board to Board) within the Rectangular Connectors category. It is specified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for standard handling and processing conditions. The REACH status is listed as Unaffected.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.00 | $1.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The connector has 80 positions.
The pitch is 0.80mm (0.031 inches).
It uses surface mount technology.
The contact finish is gold with a thickness of 8.00 microinches (0.203 micrometers).
The height above the board is 8.35mm.
The mated stacking height is 11.5mm.