BAT54JFILM-HQ
STMicroelectronics
The STMicroelectronics BAT54JFILM-HQ is a Schottky diode array designed for surface mount applications. It offers a 40V reverse voltage and 200mA average rectified current per diode.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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5,460 pcs
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5460 pcs | On Request | 1 | On Request | On Request | 1348+ | On Request | On Request |
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The OZMICRO OZ8384LN-A3-0-TR is a BGA Chipset designed for various electronic applications. This component adheres to RoHS3 standards and is REACH unaffected, indicating compliance with environmental regulations.
It is classified with a Moisture Sensitivity Level (MSL) of 1 Unlimited, meaning it requires specific handling procedures to prevent moisture absorption before soldering. The BGA (Ball Grid Array) package type suggests surface-mount technology, requiring appropriate reflow soldering processes.
Precautions for handling BGA chips as moisture-sensitive devices are noted, including recommended baking procedures. For lead-free/No Pb BGA chips, maximum reflow temperatures are between 245℃-260℃, while for leaded/Pb BGA chips, the maximum is 180℃-205℃.
This part is suitable for applications where a reliable BGA chipset is required, with considerations for its moisture sensitivity and soldering temperature requirements.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.93 | $1.93 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The RoHS status is RoHS3 Compliant.
The MSL is Level 1 Unlimited.
It is a moisture-sensitive device and requires baking before mounting. Recommended baking is 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours.
For lead-free/No Pb BGA chips, the maximum temperature is 245℃-260℃. For leaded/Pb BGA chips, the maximum is 180℃-205℃.