| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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45 pcs
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45 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The NXP Semiconductors NVT2006PW,118 is a versatile bidirectional voltage level translator designed for open-drain and push-pull applications. It operates across a wide voltage range, supporting Vref(A) from 1.0 V to 3.6 V and Vref(B) from 1.8 V to 5.5 V, enabling seamless translation between 1.0 V and 5 V without requiring a direction pin.
This translator features 6 channels per circuit and offers auto-direction sensing. It supports bidirectional data flow and provides open-drain and push-pull output types. The device boasts a low ON-state resistance of 3.5 Ω, minimizing signal distortion, and a maximum propagation delay of less than 1.5 ns for high-speed applications.
Packaged in a 16-TSSOP, the NVT2006PW,118 is suitable for surface mount applications. It operates within a temperature range of -40°C to 85°C (TA). The device also includes robust ESD protection, exceeding 3.5 kV HBM and 1000 V CDM, making it suitable for protecting lower voltage devices.
Key electrical characteristics include its ability to translate between various voltage levels such as 1.0 V to 5 V, 1.2 V to 5 V, 1.8 V to 5 V, 2.5 V to 5 V, and 3.3 V to 5 V. The translator is designed for lock-up free operation and features a flow-through pinout for easier PCB trace routing.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.12 | $0.12 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The device supports two voltage domains: Vref(A) from 1.0V to 3.6V and Vref(B) from 1.8V to 5.0V.
It is available in a 16-TSSOP surface mount package.
The operating temperature range is -40°C to 85°C.
It has 6 bidirectional channels.
The output can be configured as open-drain or push-pull.
The propagation delay is less than 1.5ns maximum under specified test conditions.
Yes, it exceeds 3.5kV HBM and 1000V CDM ESD protection.