| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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5 pcs
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5 pcs | On Request | 1 | On Request | On Request | 2026-02-25 06:16:38 | On Request | On Request |
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The NTE Electronics NTE403 is a board-level heat sink designed for effective thermal management of power transistors. Constructed from a durable aluminum alloy, it offers a fin height of 0.500" (12.70mm) and a width of 0.710" (18.03mm), with a length of 1.000" (25.40mm). The heat sink has a thermal resistance of 20.30°C/W under natural convection.
This heat sink is suitable for cooling packages such as TO-3P, TO-126, TO-127, TO-202, TO-218, and TO-220. It features a rectangular shape with fins and a black anodized material finish for enhanced durability and heat dissipation. The attachment method is bolt-on, providing a secure mounting solution for various applications requiring efficient heat removal from electronic components.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.00 | $2.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The fin height of the NTE403 heat sink is 12.70mm (0.500").
The NTE403 heat sink is designed to cool TO-3P, TO-126, TO-127, TO-202, TO-218, and TO-220 packages.
The NTE403 heat sink is made of aluminum alloy.
The thermal resistance of the NTE403 heat sink at natural convection is 20.30°C/W.
The NTE403 heat sink features a bolt-on attachment method.
The RoHS status of the NTE403 heat sink is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the NTE403 heat sink is 1 Unlimited.