NGTD13T65F2WP The NGTD13T65F2WP is an IGBT Die from On Semiconductor, designed for motor drive and inverter applications. It offers a 650V collector-emitter voltage and a 120A pulsed collector current.
Mfr Part #:

NGTD13T65F2WP

Available from 1 distributors
Mfr Name: On Semiconductor
On Semiconductor
The NGTD13T65F2WP is an IGBT Die from On Semiconductor, designed for motor drive and inverter applications. It offers a 650V collector-emitter voltage and a 120A pulsed collector current.
Total Stock: 6,469 pcs
$ Price Range: $0.99

NGTD13T65F2WP Available from 1 distributor

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6,469 pcs
6469 pcs On Request 1 On Request On Request On Request On Request On Request

NGTD13T65F2WP Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Collector-Emitter Breakdown Voltage
Collector-Emitter Cutoff Current
Current
Current (Maximum)
Die Size
Die Thickness
Gate Leakage Current
Gate-Emitter Threshold Voltage
IGBT Type
Input Capacitance
Input Type
Mounting Type
Operating Temperature
Operating Temperature - Maximum
Output Capacitance
Reverse Transfer Capacitance
Short Circuit Withstand Time
Supplier Device Package
Vce Sat (Maximum @ VGE = 15 V, IC = 30 A)
Vce(on) (Max) @ Vge, Ic
Voltage
Voltage - Maximum
Wafer Size
current (Maximum @ Note 2)

NGTD13T65F2WP Description

Short technical summary and product information.

The NGTD13T65F2WP is a Trench Field Stop II IGBT Die from ON Semiconductor, suitable for motor drive and inverter applications. It features an extremely efficient Trench with Field Stop Technology and low VCE(sat) loss, reducing system power dissipation.

 

Key electrical specifications include a collector-emitter voltage of 650V and a pulsed collector current of 120A. The device operates over a wide temperature range of -55°C to 175°C. It is supplied as a bare die, intended for surface mounting.

 

Typical applications for this IGBT die include industrial motor drives, solar inverters, UPS systems, and welding equipment. The die size is 3550 x 3550 µm², with a die thickness of 3 mils. It is packaged as a die on tape in a ring-pack, with a storage time of less than 3 months recommended.

NGTD13T65F2WP Quick Information

Product Type: IGBT Die
Canonical Name: NGTD13T65F2WP Trench Field Stop II IGBT Die
Subcategory: IGBTs - Single

NGTD13T65F2WP Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

NGTD13T65F2WP Estimated Pricing

Qty Low High
1+ $0.99 $0.99

Estimated market price range - modelled values for guidance only, not live distributor offers.

NGTD13T65F2WP Features

  • 650V collector-emitter voltage rating.
  • 120A pulsed collector current capability.
  • Wide -55°C to 175°C operating temperature.
  • Trench Field Stop II IGBT technology.
  • Low VCE(sat) for reduced dissipation.

NGTD13T65F2WP Applications

  • Ideal for industrial motor drives.
  • Suitable for solar inverter systems.
  • Used in UPS power supplies.
  • Applicable for welding equipment.

NGTD13T65F2WP FAQs

7 frequently asked questions generated from this part’s specifications.
What is the collector-emitter voltage of the NGTD13T65F2WP?

The collector-emitter voltage is 650V.

What is the maximum pulsed collector current?

The maximum pulsed collector current is 120A.

What is the operating temperature range for this IGBT die?

The operating temperature range is -55°C to 175°C.

What type of IGBT technology does the NGTD13T65F2WP use?

It uses Trench Field Stop II IGBT technology.

What is the collector-emitter saturation voltage?

The collector-emitter saturation voltage is 2.2V at 15V gate-emitter voltage and 30A collector current.

What is the gate-emitter threshold voltage?

The gate-emitter threshold voltage is typically 5.5V, with a range of 4.5V to 6.5V.

What is the package type for the NGTD13T65F2WP?

The package type is Die, supplied as a bare wafer on tape.

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