| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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318 pcs
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318 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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This Micron Technology MT53D1024M32D4DT-046 WT:D is a high-density DRAM memory integrated circuit. It offers a substantial 32 Gbit storage capacity, making it suitable for demanding applications requiring significant data buffering or storage.
The component operates at a clock frequency of 2.133 GHz, enabling fast data access and transfer rates. Its technology is SDRAM - Mobile LPDDR4, designed for power efficiency and performance in mobile and embedded systems. The operating voltage is 1.1V, further contributing to its energy-conscious design.
Packaged in a 200-VFBGA (10x14.5) format, this memory chip is designed for surface mounting. The operating temperature range is specified as -30°C to 85°C (TC), providing operational stability across a moderate environmental spectrum. The memory organization is 1G x 32, detailing its internal structure for data management.
Compliance information indicates RoHS3 compliance and Moisture Sensitivity Level 1 (MSL 1), suggesting standard handling procedures. REACH status is noted as unaffected.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The memory capacity is 32 Gbit.
The clock frequency is 2.133 GHz.
It uses SDRAM - Mobile LPDDR4 technology.
The operating voltage is 1.1V.
The operating temperature range is -30°C to 85°C (TC).
It is supplied in a 200-VFBGA package.
The Moisture Sensitivity Level is 1 Unlimited.