| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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2,260 pcs
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2260 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | 15+ | On Request | On Request | |
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750 pcs
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750 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
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238 pcs
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238 pcs | On Request | 1 | On Request | On Request | 12+ | On Request | On Request | |
|
5 pcs
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5 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The MT62F2G32D4DS-020 WT:F from Micron Technology is a high-performance LPDDR5 SDRAM memory integrated circuit. It offers a substantial 32Gb memory density with a 4GB capacity and a 2G x 32 organization, providing a 32-bit data bus width for efficient data transfer.
Designed for demanding applications, this memory IC features a high-bandwidth LPDDR5 interface and supports ultra-low power operation. The core voltage is rated at approximately 1.05V, with I/O voltages around 0.5V, optimizing power efficiency. The operating temperature range is specified from -25°C to +85°C, making it suitable for mobile and embedded systems.
Packaged in a compact 315-ball TFBGA, the MT62F2G32D4DS-020 WT:F is well-suited for space-constrained designs. Its advanced power management features and high-speed capabilities make it an ideal choice for smartphones, automotive infotainment systems, AI edge computing devices, and industrial embedded platforms requiring next-generation memory performance.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The MT41J128M16HA15ED is an LPDDR5 SDRAM memory device.
It has a density of 32Gb and a capacity of 4GB.
The memory is organized as 2G x 32 bits.
The data bus width is 32 bits.
The core voltage is 1.05V and the I/O voltage is 0.5V (LPDDR5 signaling).
The device is packaged in a 315-ball TFBGA (Thin Fine-Pitch Ball Grid Array).
The operating temperature range is -25°C to +85°C.