| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
8,000 pcs
|
8000 pcs | On Request | 1 | On Request | On Request | 2021+ | On Request | On Request | |
|
1,081 pcs
|
1081 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The MT29RZ4B2DZZHHWD-18I.84F is a multi-chip package memory device from Micron Technology that integrates 4Gbit NAND Flash and 2Gbit LPDDR2 RAM in a single 162-VFBGA package. This combination provides both non-volatile storage and volatile high-speed memory for embedded applications.
The NAND Flash portion is organized as 128M x 32 and provides non-volatile data storage. The LPDDR2 RAM portion is organized as 64M x 32 and offers volatile memory with a clock frequency of 533 MHz. The device operates at 1.8V and supports an extended industrial temperature range of -40°C to 85°C.
The memory interface is parallel, and the device is surface mount with a supplier device package of 162-VFBGA (10.5x8). This package is suitable for space-constrained designs requiring both Flash and RAM in a single component.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The device has 4Gbit NAND Flash and 2Gbit LPDDR2 RAM.
The operating voltage is 1.8V.
The clock frequency is 533 MHz.
The operating temperature range is -40°C to 85°C.
It comes in a 162-VFBGA package (10.5x8).
The memory interface is parallel.
The NAND Flash is organized as 128M x 32 and the LPDDR2 RAM as 64M x 32.
