| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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20 pcs
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20 pcs | On Request | 1 | On Request | On Request | 14+ | On Request | On Request |
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| ESD Protection | |
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| Technology |
This Micron Technology MT29F8G08ABACAWP:C is a high-density parallel flash memory component designed for various storage applications. It offers a substantial memory size of 8 Gbit, organized as 1G x 8 bits, utilizing NAND flash technology.
The device operates reliably within a supply voltage range of 2.7V to 3.6V, making it suitable for a wide array of electronic systems. Its operating temperature range is specified from 0°C to 70°C (TA), ensuring performance in typical environmental conditions.
The MT29F8G08ABACAWP:C is supplied in a 48-TSOP I package, designed for surface mounting. This packaging facilitates integration into compact PCB designs. The parallel interface ensures efficient data transfer for applications requiring direct memory access.
Packaged in trays, this component adheres to industry standards for ESD protection, utilizing static shielding materials to safeguard against electrostatic discharge during handling and transit. This ensures the integrity and reliability of the component from shipment to final application.
The memory size is 8 Gbit.
The operating voltage range is 2.7V to 3.6V.
The operating temperature range is 0°C to 70°C.
It is supplied in a 48-TSOP I package.
It is a surface mount component.
It is RoHS3 Compliant.