| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
100 pcs
|
100 pcs | On Request | 1 | On Request | On Request | 13+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Clock Frequency | |
| Memory Format | |
| Memory Interface | |
| Memory Organization | |
| Memory Size | |
| Memory Type | |
| Mounting Type | |
| Operating Temperature | |
| Supplier Device Package | |
| Supplier Package | |
| Technology | |
| Voltage |
The Micron Technology MT29C1G12MAACAFAKD-6 IT is a Multichip Package (MCP) combining NAND Flash and Mobile LPDRAM memory technologies within a single component. This device is designed for applications requiring both non-volatile and volatile memory, offering a 1Gbit NAND Flash capacity and a 512Mbit LPDRAM capacity.
Key electrical specifications include a low operating voltage range of 1.7V to 1.95V and a clock frequency of 166 MHz for the LPDRAM interface. The NAND Flash is organized as 128M x 8, and the LPDRAM as 16M x 32. The operating temperature range is industrial, from -40°C to +85°C.
This component utilizes a parallel memory interface and is housed in a 137-TFBGA package, suitable for surface mounting. The package dimensions are 10.5x13mm. The device is specified as RoHS3 compliant and has an MSL rating of 1.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
1.70V to 1.95V.
137-TFBGA (10.5x13 mm).
-40°C to +85°C.
1Gbit NAND Flash and 512Mbit LPDRAM.
166 MHz.
Parallel interface.