| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,994 pcs
|
3994 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Core Processor | |
| Ethernet | |
| Mounting Type | |
| Operating Temperature | |
| Security Features | |
| Speed | |
| Supplier Device Package | |
| USB |
The NXP Semiconductors MPC8555EPXAPF is a high-performance microprocessor designed for embedded applications. It utilizes the ARM Cortex-A9 core architecture, delivering a speed of 852MHz with a 4-core, 32-bit configuration.
This processor integrates multimedia capabilities with NEON™ SIMD, supports various RAM controllers including LPDDR2, LVDDR3, and DDR3, and includes graphics acceleration. Connectivity options feature Ethernet (10/100/1000Mbps), SATA 3Gbps, and multiple USB 2.0 ports with PHY.
Designed for demanding environments, the MPC8555EPXAPF operates within a temperature range of -40°C to 125°C (TJ). It is housed in a 624-FBGA, FCBGA package and is designed for surface mounting.
Security features include ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, and Tamper Detection, making it suitable for secure applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The core processor is ARM® Cortex®-A9.
The operating speed is 852MHz.
It has 4 cores and a 32-bit bus width.
It supports LPDDR2, LVDDR3, and DDR3 RAM controllers.
The operating temperature range is -40°C to 125°C (TJ).
It is supplied in a 624-FBGA, FCBGA package.
The I/O voltage levels are 1.8V, 2.5V, 2.8V, and 3.3V.