| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
2,613 pcs
|
2613 pcs | On Request | 1 | On Request | On Request | 1107+ | On Request | On Request |
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| Manufacturer Name | |
| Core Processor | |
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| Tape & Reel | |
| Voltage |
The MPC7410HX500LE is a high-performance microprocessor manufactured by NXP USA Inc. (formerly Freescale Semiconductor). It operates at a speed of 500MHz and is built on the PowerPC G4 architecture, featuring a single 32-bit core.
This microprocessor supports multiple I/O voltages, including 1.8V, 2.5V, and 3.3V, making it versatile for various system designs. It is designed for surface mount installation and comes in a 360-FCCBGA package, with a supplier device package specified as 360-CBGA (25x25).
The operating temperature range for the MPC7410HX500LE is from 0°C to 105°C (TA). The product is listed as RoHS non-compliant. Packaging details indicate it is supplied in trays and utilizes industry-standard static shielding packaging to protect against electrostatic discharge during handling and transportation.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.93 | $1.93 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The MPC7410HX500LE operates at a speed of 500MHz.
The MPC7410HX500LE uses the PowerPC G4 core processor.
The MPC7410HX500LE supports I/O voltages of 1.8V, 2.5V, and 3.3V.
The operating temperature range for the MPC7410HX500LE is 0°C to 105°C (TA).
The MPC7410HX500LE is supplied in a 360-BCBGA, FCCBGA package and is available in trays.