| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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70 pcs
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70 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The 3M MP2-S210G-51M1-C-TG30 is a Futurebus+ style backplane receptacle designed for high-density backplane interconnections. It features 210 positions in a 5-row configuration with a 2.00mm pitch, providing a compact yet high-pin-count interface. The connector uses a board edge, through-hole, right angle mounting style, making it suitable for card-edge applications where space is constrained.
Termination is via solder, and the contacts are finished with gold (30µin / 0.76µm thickness) for reliable conductivity and corrosion resistance. The connector housing is beige in color and includes integrated features such as a board guide, board lock, and spacer to assist with alignment, retention, and board support during assembly.
Designed for backplane usage, this connector is commonly employed in telecommunications, server, and industrial control equipment where robust, high-density connections are required. The right angle orientation allows for efficient routing of signals perpendicular to the backplane.
| Qty | Low | High |
|---|---|---|
| 120+ | $15.07 | $15.07 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The connector has 210 positions, and all positions are loaded.
The pitch is 2.00mm (0.079 inches).
It uses board edge, through hole, right angle mounting.
It has 5 rows.
The contact finish is gold with a thickness of 30µin (0.76µm).
It includes a board guide, board lock, and spacer.