| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,000 pcs
|
1000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name |
The ST MK53761N-00 is an integrated circuit manufactured by ST, presented in a DIP package. This component is currently active and designated as RoHS3 Compliant, with a Moisture Sensitivity Level (MSL) of 1, indicating unlimited usability under standard conditions.
Detailed specifications such as operating voltage and temperature are not provided in the available data. The component's status is active, suggesting it is intended for current production and design cycles. The DIP (Dual In-line Package) form factor is a common through-hole mounting type, suitable for breadboarding and through-hole soldering processes.
Further information regarding specific electrical characteristics, operating conditions, and detailed compliance data would typically be found in the manufacturer's datasheet. However, the provided information confirms its basic package type and RoHS status.
| Qty | Low | High |
|---|---|---|
| 1+ | $6.79 | $6.79 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The ST MK53761N-00 is supplied in a DIP package.
The MK53761N-00 is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) for the MK53761N-00 is 1 Unlimited.
The REACH status for the MK53761N-00 is Unaffected.
Yes, the product status for the ST MK53761N-00 is Active.