| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
780 pcs
|
780 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Applications | |
| Automotive Grade | |
| Industrial Grade | |
| Military Grade | |
| Mounting Type | |
| Operating Temperature | |
| Supplier Device Package | |
| Voltage |
The MFS8633BMDA0ES is a system basis chip (SBC) from NXP Semiconductors, designed for power management in camera applications. It operates from a supply voltage of 4.5V to 36V and is rated for a temperature range of -40°C to 125°C. The device is housed in a 48-VFQFN Exposed Pad package, with a physical footprint of 7x7 mm (48-QFN). It is surface mountable, making it suitable for compact designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.75 | $0.75 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
4.5V to 36V.
48-VFQFN Exposed Pad, with supplier device package 48-QFN (7x7).
-40°C to 125°C.
Surface Mount.
Camera applications.