| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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1 pcs
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1 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The ITT Cannon MDM25SBSP is a D-Sub connector assembly designed for reliable interconnectivity. This component adheres to RoHS3 compliance standards, indicating its suitability for environmentally conscious applications. It also meets Moisture Sensitivity Level 1 (MSL 1) requirements, signifying its robustness against moisture absorption during handling and assembly processes.
As a D-Sub connector assembly, the MDM25SBSP is engineered for robust connections in various electronic systems. While specific electrical and mechanical specifications like positions, current rating, and voltage rating are not detailed here, its classification suggests it is intended for signal or power transmission where D-Sub interfaces are standard. The component's design prioritizes durability and performance in typical operating environments.
This connector assembly is suitable for integration into a wide range of electronic devices and systems. Its compliance with industry standards like RoHS3 and MSL 1 makes it a dependable choice for manufacturers seeking high-quality interconnect solutions. Further details on mounting and termination styles would be available in the product's datasheet.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.00 | $1.00 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The ITT Cannon MDM25SBSP is RoHS3 Compliant.
The MSL for the MDM25SBSP is Level 1.
The MDM25SBSP is REACH Unaffected.