| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,012 pcs
|
1012 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
700 pcs
|
700 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The MC33FS6522LAE from NXP Semiconductors is a specialized power management integrated circuit designed as a System Basis Chip. This component is suitable for applications requiring a voltage range of 1V to 5V and can operate reliably in environments with temperatures between -40°C and 125°C.
This device features a surface mount package, specifically a 48-LQFP Exposed Pad (48-HLQFP (7x7)), facilitating integration into various electronic designs. Its RoHS3 compliance indicates adherence to environmental standards.
The MC33FS6522LAE is engineered for system basis chip functionalities, offering a versatile solution for power management needs in complex electronic systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.75 | $0.75 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is -40°C to 125°C.
The voltage range is 1V to 5V.
It is in a 48-LQFP Exposed Pad package.
It is a surface mount device.
It is used as a System Basis Chip.
