| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
6,660 pcs
|
6660 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name |
The NXP Semiconductors LPC55S26JBD100E is a microcontroller designed for embedded applications. It comes in an LQFP100 package.
This component adheres to RoHS3 compliance standards and has an MSL rating of Level 1, indicating unlimited usability under standard conditions. The REACH status is unaffected.
NXP Semiconductors has standardized the packaging for this type of component, utilizing an LQFP 14x14x1.4 tray and a 5+1 Tray Dry-Pack method. This standardization aims to consolidate manufacturing and avoid issues with mixed tray vendors. Critical tray dimensions remain unchanged, though minor attributes like end tab embossment and color stripe may differ.
This microcontroller is suitable for various embedded systems where reliable performance and standard compliance are essential.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.50 | $2.50 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The LPC55S26JBD100E is RoHS3 Compliant.
The MSL for the LPC55S26JBD100E is Level 1.
The LPC55S26JBD100E is supplied in an LQFP100 package.
The LPC55S26JBD100E uses the 5+1 Tray Dry-Pack packing method.