| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
8,460 pcs
|
8460 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
526 pcs
|
526 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Industrial Grade | |
| Medical Grade | |
| Military Grade | |
| Storage Temperature | |
| Tape & Reel |
The LPC1767FBD100 from NXP Semiconductors is an integrated circuit belonging to the FPGA with Microcontroller category. This component is designed for embedded systems requiring both field-programmable logic and microcontroller capabilities.
Key specifications include RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for a wide range of manufacturing environments. The REACH status is noted as unaffected.
This part is intended for applications where flexible, reconfigurable logic combined with processing power is essential. Its design considerations would typically involve integration into complex embedded systems, requiring careful attention to its specific electrical and mechanical characteristics, which are detailed in the manufacturer's documentation.
Further details regarding package type, mounting, and specific operational parameters should be consulted from the official NXP Semiconductors datasheets or product pages.
| Qty | Low | High |
|---|---|---|
| 1+ | $2.50 | $2.50 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The LPC1767FBD100 is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.