| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
100,000 pcs
|
100000 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Features | |
| Halogen Free | |
| Industrial Grade | |
| Lead Style | |
| Medical Grade | |
| Military Grade | |
| Operating Temperature Range | |
| Output Current | |
| SVHC Present | |
| Tape & Reel |
The Texas Instruments LP2998MAX is a linear regulator specifically designed to meet JEDEC SSTL-2 and JEDEC SSTL-18 specifications for DDR-SDRAM and DDR2 memory termination. It also supports DDR3 and DDR3L VTT bus termination with a minimum VDDQ of 1.35V.
This regulator features a high-speed operational amplifier and provides an output current of 1.5A. Key electrical characteristics include a minimum VDDQ source and sink current of 1.35V. The device operates over a wide temperature range of -40°C to 125°C.
Packaged in an 8-pin SOIC, the LP2998MAX is suitable for surface-mount applications. Its design includes features such as low output voltage offset, no external resistors required, linear topology, Suspend to RAM (STR) functionality, low external component count, and thermal shutdown protection.
The LP2998MAX is an AEC-Q100 qualified device, indicating its suitability for demanding automotive and industrial applications requiring reliable termination voltage regulation for DDR memory systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.75 | $0.75 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The LP2998MAX comes in an SOIC (D) package with 8 pins.
The operating temperature range is –40 to 125°C.
The device can output 1.5A continuously.
It supports DDR, DDR2, DDR3, and DDR3L memory with a minimum VDDQ of 1.35V.
The HBM ESD classification level is H1C.
It includes low output voltage offset, no external resistors required, suspend-to-ram functionality, low external component count, and thermal shutdown.