| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
72,320 pcs
|
72320 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| SVHC Present | |
| Tape & Reel |
The LMV932IDR from Texas Instruments is a dual operational amplifier designed for low-voltage and portable applications. It is specified for operation from 1.8 V to 5 V, making it suitable for single-cell or two-cell battery-powered devices.
Key electrical characteristics include a typical gain bandwidth of 1.4 MHz and a low supply current of 100 µA per amplifier. The device features rail-to-rail output swing, providing 80 mV from the rail with a 600-ohm load and 30 mV from the rail with a 2-kohm load. The common-mode input voltage range extends 200 mV beyond the rails, and the maximum input offset voltage is 4 mV.
This operational amplifier is available in a surface-mount SOIC package, suitable for various industrial, automotive, and consumer electronics applications. Its space-saving design and low power consumption make it a versatile choice for battery-monitored systems and supply-current monitoring.
Applications include industrial utility and energy metering, automotive systems, communications equipment such as optical telecom and data/voice cable modems, and consumer electronics like PDAs, PCs, CDR/W, and portable audio devices.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The typical gain bandwidth of the LMV932IDR is 1.4 MHz.
The supply current per amplifier for the LMV932IDR is typically 100 µA.
The output voltage swing is 80 mV from the rail with a 600-ohm load.
The output voltage swing is 30 mV from the rail with a 2-kohm load.
The typical common-mode input voltage range is 200 mV beyond the rails.
The maximum input offset voltage is 4 mV.
The LMV932IDR is available in an SOIC package.