Mfr Part #:

LCMXO2280C-4FTN256C

Mfr Name: Lattice Semiconductor Corporation

The Lattice Semiconductor LCMXO2280C-4FTN256C is a Field Programmable Gate Array (FPGA) with 2280 logic elements and 211 I/O pins. It features 28.262 Kbits of RAM and operates within a voltage range of 1.71V to 3.465V.

✓ Total Stock: 187 pcs

LCMXO2280C-4FTN256C Available from 2 distributors

✓ Authorised

✓ Non-Authorised

Distributor		Stock	Pricing	MOQ	PKG	Lead Time	Date Code	On Order Quantity	On Order Delivery
Flip Electronics ✓ Non-Authorised Inventory information	185 pcs On Request	185 pcs	On Request	1	On Request	On Request	On Request	On Request	On Request
Speed Components Ltd ✓ Non-Authorised Inventory information	2 pcs On Request	2 pcs	On Request	1	On Request	On Request	On Request	On Request	On Request

LCMXO2280C-4FTN256C Description

Short technical summary and product information.

The Lattice Semiconductor LCMXO2280C-4FTN256C is a non-volatile, infinitely reconfigurable FPGA designed for applications traditionally addressed by CPLDs and low-capacity FPGAs, such as glue logic, bus bridging, and control logic. This device offers 2280 logic elements and 285 LABs, providing a high I/O to logic density with 211 I/O pins.

Key features include up to 28.262 Kbits of embedded memory, supporting sysMEM Embedded Block RAM and distributed RAM. The flexible sysIO buffer supports a wide range of interfaces including LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, and RSDS. The device operates with a voltage supply range of 1.71V to 3.465V and has an operating temperature range of 0°C to 85°C (TJ).

This FPGA is supplied in a 256-FTBGA (17x17) package and is designed for surface mount applications. It supports features like instant-on capability, in-field logic updates via TransFR Reconfiguration (TFR), and IEEE 1149.1 Boundary Scan. The MachXO family is known for its excellent design security and programmable I/O buffers.

LCMXO2280C-4FTN256C Quick Information

Product Type: FPGA

Series: MachXO

Canonical Name: Lattice Semiconductor LCMXO2280C-4FTN256C FPGA

Subcategory: Field Programmable Gate Array

LCMXO2280C-4FTN256C Compliance

RoHS Status: RoHS Compliant

Moisture Sensitivity Level (MSL): 1 Unlimited

REACH Status: REACH Unaffected

LCMXO2280C-4FTN256C Features

Non-volatile, infinitely reconfigurable FPGA.
Instant-on capability, powers up in microseconds.
2280 logic elements and 211 I/O pins.
Supports wide range of I/O interfaces.
Surface mount 256-FTBGA package.

LCMXO2280C-4FTN256C Applications

Glue logic and bus bridging.
Power-up control and logic.
System-level design support.
In-field logic updates.

LCMXO2280C-4FTN256C FAQs

6 frequently asked questions generated from this part’s specifications.

What is the number of logic elements in the LCMXO2280C-4FTN256C?

The LCMXO2280C-4FTN256C has 2280 logic elements.

How many I/O pins does the LCMXO2280C-4FTN256C have?

The LCMXO2280C-4FTN256C has 211 I/O pins.

What is the operating voltage range for the LCMXO2280C-4FTN256C?

The operating voltage range for the LCMXO2280C-4FTN256C is 1.71V to 3.465V.

What package type is the LCMXO2280C-4FTN256C supplied in?

The LCMXO2280C-4FTN256C is supplied in a 256-FTBGA (17x17) package.

What is the operating temperature range for this FPGA?

The operating temperature range is 0°C to 85°C (TJ).

What is the total RAM bit count for the LCMXO2280C-4FTN256C?

The LCMXO2280C-4FTN256C has a total of 28262 RAM bits.

Category	FPGAs (Field Programmable Gate Array)
Manufacturer Name	Lattice Semiconductor Corporation
Features	Non-volatile, Infinitely Reconfigurable; Instant-on – powers up in microseconds; Single chip, no external configuration memory required; Excellent design security, no bit stream to intercept; Reconfigure SRAM based logic in milliseconds; SRAM and non-volatile memory programmable through JTAG port; Supports background programming of non-volatile memory; Sleep Mode; Allows up to 100x static current reduction; TransFR Reconfiguration (TFR); In-field logic update while system operates; High I/O to Logic Density; 256 to 2280 LUT4s; 73 to 271 I/Os with extensive package options; Density migration supported; Lead free/RoHS compliant packaging; Embedded and Distributed Memory; Up to 27.6 Kbits sysMEM Embedded Block RAM; Up to 7.7 Kbits distributed RAM; Dedicated FIFO control logic; Flexible I/O Buffer; Programmable sysIO buffer supports wide range of interfaces; LVCMOS 3.3/2.5/1.8/1.5/1.2; LVTTL; PCI; LVDS, Bus-LVDS, LVPECL, RSDS; sysCLOCK PLLs; Up to two analog PLLs per device; Clock multiply, divide, and phase shifting; System Level Support; IEEE Standard 1149.1 Boundary Scan; Onboard oscillator; Devices operate with 3.3V, 2.5V, 1.8V or 1.2V power supply; IEEE 1532 compliant in-system programming
Lead Spacing	17 mm
Mounting Type	Surface Mount
Number of I	211
Number of LABs	285
Number of Logic Elements	2280
Operating Temperature	0°C ~ 85°C (TJ)
Supplier Device Package	256-FTBGA (17x17)
Tape & Reel	No
Total RAM Bits	28.262 Kbits
Voltage	1.71V ~ 3.465V