| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
37 pcs
|
37 pcs | On Request | 1 | On Request | On Request | 06/07+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| AEC Qualified | |
| Automotive Grade | |
| Halogen Free | |
| Industrial Grade | |
| Lead Style | |
| Medical Grade | |
| Military Grade | |
| Operating Voltage | |
| SVHC Present | |
| Storage Temperature | |
| Tape & Reel |
The LCMXO1200C-3FTN256C is a field-programmable gate array designed for low-power embedded applications. This device provides 600 logic elements and 256 LUT4s for digital logic implementation. It integrates up to 27.6 Kbits of sysMEM embedded block RAM and 7.7 Kbits of distributed RAM for data storage needs. Two analog phase-locked loops support clock management functions.
The part operates with a 1.2V core supply and supports multiple I/O voltage standards including 1.8V, 2.5V, and 3.3V. It features between 73 and 271 available I/O pins depending on the specific configuration variant. The device is housed in a 256-ball fine-pitch ball grid array package suitable for surface-mount assembly.
Engineers utilize this FPGA for signal processing, protocol conversion, and control logic in industrial and consumer electronics. The low power consumption and small form factor make it appropriate for battery-operated systems and space-constrained designs. Procurement teams should verify exact pin counts and voltage configurations against specific project requirements before ordering.
The device contains 600 macro cells and 256 LUT4s.
It provides up to 27.6 Kbits of sysMEM embedded block RAM and 7.7 Kbits of distributed RAM.
The core operates at 1.2V while I/O pins support 1.8V, 2.5V, and 3.3V standards.
The component is supplied in a 256-ball FTBGA tray-packaged housing.
The device offers 73 to 271 available I/O pins depending on the specific variant.