| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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2 pcs
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2 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Bluetooth | |
| Chipset | |
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| Host Interface | |
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| Tape & Reel | |
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| Wi-Fi | |
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The Murata LBEE5ZZ1PJ-377 is a compact, shielded Wi-Fi 5 and Bluetooth 5.0 module designed for consumer and industrial IoT applications. It integrates dual-band 2.4GHz and 5GHz Wi-Fi capabilities compliant with IEEE 802.11a/b/g/n/ac standards, offering a data rate of up to 433Mbps.
This module utilizes the Qualcomm QCA9377-3 chipset and supports Bluetooth 5.0 BR/EDR/LE. It features SDIO and UART host interfaces for Wi-Fi and Bluetooth respectively, and a PCM/I2S peripheral interface. The module operates within a temperature range of -30°C to 85°C and is supplied with voltages of 1.8V or 3.3V.
Packaged in a shielded resin SMT form factor with dimensions of 7.2 x 7.4 x 1.25 mm, the LBEE5ZZ1PJ-377 is suitable for space-constrained designs. It is designed for high-performance wireless connectivity in industrial IoT, smart home devices, sensor networks, and gateway applications. The module is certified for FCC/IC and ETSI standards.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The module supports Wi-Fi 5, compliant with IEEE 802.11a/b/g/n/ac standards.
The module integrates Bluetooth 5.0 BR/EDR/LE.
The operating temperature range is -30°C to 85°C.
The module dimensions are 7.2 x 7.4 x 1.25 mm.
The mounting type is SMT (Surface Mount Technology).
The module uses the Qualcomm QCA9377-3 chipset.