| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
37,177 pcs
|
37177 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Automotive Grade | |
| Lead Spacing | |
| Mounting Type | |
| Number of I | |
| Number of LABs | |
| Number of Logic Elements | |
| Operating Temperature | |
| Supplier Device Package | |
| Total RAM Bits | |
| Voltage |
The LAMXO3LF-2100C-5BG256E is an integrated circuit FPGA manufactured by Lattice Semiconductor Corporation. It features 2100 logic elements, 75776 RAM bits, 263 LABs, and 206 I/O pins. The device is designed for embedded applications requiring high logic density and I/O capacity. It is packaged in a 256-LFBGA case with a 256-CABGA (14x14) supplier device package, suitable for surface mounting on printed circuit boards.
This FPGA supports applications in digital signal processing, communications, and embedded control systems. Its surface-mount design allows for compact and reliable integration into complex electronic systems. The device's thermal and electrical specifications are optimized for high-performance operation within the specified temperature range of -40°C to 125°C.
The package's surface-mount mounting type facilitates automated assembly processes, making it suitable for high-volume manufacturing. The device's pin configuration and package dimensions are compatible with standard PCB layouts for FPGA integration.
The FPGA has 2100 logic elements.
It supports 206 I/O pins.
-40°C to 125°C.
It uses a 256-LFBGA package.