| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
824 pcs
|
824 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The KMR21000BM-B809 from Samsung Electronics is a Multi-Chip Package (MCP) memory solution. It integrates 32GB of e.MMC storage with 24Gb of LPDDR3 SDRAM, offering a combination of high-speed data access and storage capacity.
This component is designed for a wide operating temperature range, from -25°C to 85°C, making it suitable for various environmental conditions. The package type is a 221-Ball FBGA, measuring 11.5mm x 13mm x 1.1mm with a 0.5mm ball pitch, intended for surface mount applications.
The e.MMC portion is compatible with version 5.0 of the standard and supports HS400 mode for high-speed data transfer up to 400Mbps. It also supports data bus widths of 1, 4, and 8 bits, with an interface clock frequency ranging from 0 to 200MHz. The LPDDR3 SDRAM utilizes a double-data rate architecture for efficient data transfers.
Supported features include Packed Command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, and Dynamic Device Capacity. The interface power for the e.MMC can be supplied between 1.70V to 1.95V or 2.7V to 3.6V, while the memory power operates from 2.7V to 3.6V.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.93 | $1.93 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The operating temperature range is -25°C to 85°C.
It uses a 221-FBGA package.
It integrates 32GB of e.MMC and 24Gb of LPDDR3 SDRAM.
The e.MMC is compatible with version 5.0.
The e.MMC supports HS400 mode.