| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,800 pcs
|
1800 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name | |
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The Samsung Electronics KMQE60013B-B318009 is an embedded Multi-Chip Package (EMCP) device featuring 16GB of eMMC (embedded MultiMediaCard) storage combined with 16GB of LPDDR3 (Low Power Double Data Rate 3) RAM.
This component operates at a nominal voltage of 2V and achieves a data transfer speed of 1866MBPS. It is designed for a wide operating temperature range, from -25°C to +125°C, making it suitable for various environmental conditions.
The KMQE60013B-B318009 is supplied in an FBGA-221 package, which is a Ball Grid Array package type. The standard package quantity is listed as 11,200 units.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The KMQE60013B-B318009 features 16GB of eMMC storage and 16GB of LPDDR3 RAM.
The operating voltage for this component is 2V.
The data speed is 1866MBPS.
The component operates within a temperature range of -25°C to +125°C.
It is supplied in an FBGA-221 package.