| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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40 pcs
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40 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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| Manufacturer Name |
The KLS1023AXE7MQB is a semiconductor component manufactured by NXP Semiconductors. This part is noted for its RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating it is not sensitive to moisture under typical conditions.
The REACH status is listed as unaffected. The component utilizes an FC-PBGA package type, with specific mention of an industrial lidded part variant using LCFC 780 balls with a lid. Further details regarding its electrical specifications, such as the assertion time of PORESET_B after stable SYSCLK, are available in the datasheet.
This component is suitable for various industrial applications where reliable semiconductor performance is required. Its packaging details suggest suitability for automated assembly processes.
| Qty | Low | High |
|---|---|---|
| 1+ | $0.99 | $0.99 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The KLS1023AXE7MQB is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is Unaffected.
The KLS1023AXE7MQB uses an FC-PBGA package.
Yes, an industrial lidded part is available with an LCFC 780 balls with lid package.