SL3S1206FUD2/HAA-VB2
NXP Semiconductors
The NXP Semiconductors SL3S1206FUD2/HAA-VB2 is a Chassis Mount Resistor. It is RoHS3 Compliant and REACH Unaffected.
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2,262 pcs
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2262 pcs | On Request | 1 | On Request | On Request | 16+ | On Request | On Request | |
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1,420 pcs
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1420 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Samsung Electronics KLM8G1WEPD-B031 is a memory module optimized for high-performance and low-power consumption, suitable for various digital signal processing applications. This component features a BGA-153 package, which is crucial for its integration into electronic circuits. The pinout configuration ensures correct connections for optimal device performance.
This memory module adheres to RoHS3 compliance standards and has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited usability under standard conditions. Its REACH status is unaffected. The component is designed to provide excellent performance in demanding applications.
Key specifications include its BGA-153 package type. Further details regarding operating voltage, temperature, and specific memory type would typically be found in the datasheet. The pinout details are essential for proper circuit design and integration, defining the role of each pin for power, ground, and signal interfaces.
The KLM8G1WEPD-B031 is supplied in a BGA-153 package.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.
