| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
3,768 pcs
|
3768 pcs | On Request | 1 | On Request | On Request | 15+ | On Request | On Request | |
|
971 pcs
|
971 pcs | On Request | 1 | On Request | On Request | 17+ | On Request | On Request | |
|
120 pcs
|
120 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Architecture | |
| Lead Spacing | |
| Tape & Reel |
The KLM8G1GEND-B031 is a memory card manufactured by Samsung Electronics. It offers a chip density of 64 Gbit and utilizes a sectored architecture with boot block capabilities.
This memory card operates with a synchronous timing type and features a Serial e-MMC interface. Its maximum operating frequency is 200 MHz, with a typical operating supply voltage range of 3V to 3.3V. The minimum operating temperature is -25°C.
The KLM8G1GEND-B031 is packaged in an FBGA-153 case. The part status is listed as obsolete. It is classified as a memory card and is not intended for automotive applications.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.20 | $10.20 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The chip density is 64 Gbit.
The interface type is Serial e-MMC.
The maximum operating frequency is 200 MHz.
The typical operating supply voltage is 3V or 3.3V.
The minimum operating temperature is -25 °C.
The package type is FBGA-153.
The RoHS status is RoHS3 Compliant.