| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
1,205 pcs
|
1205 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
960 pcs
|
960 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request | |
|
960 pcs
|
960 pcs | On Request | 1 | On Request | On Request | 11+ | On Request | On Request |
| Category | |
| Manufacturer Name |
The Samsung Electronics K7J161882B-EI30 is an active semiconductor component designed for advanced electronic applications. This memory integrated circuit comes in a BGA (Ball Grid Array) package, suitable for high-performance integration in memory and computing devices.
Key specifications include RoHS3 compliance and a Moisture Sensitivity Level (MSL) of 1 Unlimited, indicating its suitability for various manufacturing environments. The component status is active, ensuring ongoing availability for new designs and replacements.
This memory IC is part of Samsung Electronics' product line, known for its reliability and performance in demanding applications. Its BGA packaging facilitates compact board designs and efficient thermal management, making it a versatile choice for modern electronic systems.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The SAMSUNG K7J161882B-EI30 is an active semiconductor component in BGA package format, designed for advanced electronic applications. It is commonly used in memory and computing devices where high-performance integration is required.
The K7J161882B-EI30 features a BGA (Ball Grid Array) package.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The REACH status is REACH Unaffected.