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K5L5563CAA-D770 The Samsung Electronics K5L5563CAA-D770 is a Multi Chip Package Memory combining 256Mbit NOR Flash and 64Mbit UtRAM. It offers a fast read access time of 70ns.
Mfr Part #:

K5L5563CAA-D770

Available from 2 distributors
Mfr Name: Samsung Electronics
Samsung Electronics
The Samsung Electronics K5L5563CAA-D770 is a Multi Chip Package Memory combining 256Mbit NOR Flash and 64Mbit UtRAM. It offers a fast read access time of 70ns.
✓ Total Stock: 7,897 pcs
$ Price Range: $1.87

K5L5563CAA-D770 Available from 2 distributors

✓ Authorised
✓ Non-Authorised
Distributor Stock Pricing MOQ PKG Lead Time Date Code On Order Quantity On Order Delivery
Optech Co.,Limited ✓
Non-Authorised Inventory information
7,226 pcs
On Request
7226 pcs On Request 1 On Request On Request 10+ On Request On Request
Smaxon Electronics ✓
Non-Authorised Inventory information
671 pcs
On Request
671 pcs On Request 1 On Request On Request 10+08+ On Request On Request
DistyParts aggregates offers from multiple distributors. Final prices, lead times and terms are subject to the distributors' discretion and may change without prior notice. DistyParts is not liable for any discrepancies.

K5L5563CAA-D770 Specifications Quick View

Most important parameters for selection – full specs in datasheet.
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K5L5563CAA-D770 Description

Short technical summary and product information.

The K5L5563CAA-D770 from Samsung Electronics is a Multi Chip Package (MCP) memory device. It integrates a 256Mbit NOR Flash memory with a 64Mbit page UtRAM.

 

The NOR Flash component is organized as 16M x 16 bits and supports read and write operations with a single 2.7V to 3.1V power supply. It features a fast read access time of 70ns. The memory architecture includes division into 134 blocks with independent hardware protection.

 

The UtRAM component is manufactured using CMOS technology and is organized as 4M x 16 bits. It operates within a power supply voltage range of 2.7V to 3.1V and supports 4-page reads with three-state outputs.

 

This MCP memory is housed in an 84 BGA package measuring 8mm x 11.6mm x 1.0mm, suitable for surface mounting.

K5L5563CAA-D770 Quick Information

Product Type: Multi Chip Package Memory
Canonical Name: Samsung Electronics K5L5563CAA-D770 Multi Chip Package Memory
Subcategory: Multi Chip Package

K5L5563CAA-D770 Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

K5L5563CAA-D770 Estimated Pricing

Qty Low High
1+ $1.87 $1.87

Estimated market price range - modelled values for guidance only, not live distributor offers.

K5L5563CAA-D770 Features

  • Combines 256Mbit NOR Flash and 64Mbit UtRAM.
  • Fast read access time of 70ns for NOR Flash.
  • Single 2.7V to 3.1V power supply operation.
  • Organized as 16M x 16 bits for NOR Flash.
  • 84 BGA package for surface mounting.

K5L5563CAA-D770 Applications

  • Suitable for embedded systems requiring memory.
  • Used in applications needing both Flash and RAM.
  • Ideal for portable electronic devices.
  • Component for data storage and program execution.

K5L5563CAA-D770 FAQs

4 frequently asked questions generated from this part’s specifications.
What is the NOR Flash access time for the K5L5563CAA-D770?

The fast read access time for the NOR Flash is 70ns.

What is the operating voltage range for the K5L5563CAA-D770?

The operating voltage range for both the NOR Flash and UtRAM is 2.7V to 3.1V.

What type of package is the K5L5563CAA-D770 in?

The K5L5563CAA-D770 is supplied in an 84 BGA package.

What are the dimensions of the 84 BGA package?

The package dimensions are 8mm x 11.6mm x 1.0mm.

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