AS4C512M16D4A-62BINTR
Alliance
The Alliance AS4C512M16D4A-62BINTR is a memory component. It features RoHS3 compliance and an MSL of 1 Unlimited.
| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
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12,053 pcs
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12053 pcs | On Request | 1 | On Request | On Request | On Request | On Request | On Request |
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The Samsung Electronics K4X56323PN-8GC6 is a specialized integrated circuit designed for advanced memory solutions. It belongs to the Memory IC category and features a Ball Grid Array (BGA) package, which allows for compact and efficient board layouts.
This component is manufactured by Samsung Electronics, a leader in the semiconductor industry. It is optimized for high-speed processing and offers high data transfer rates, low power consumption, and stable operation across a wide temperature range. The design emphasizes enhanced durability and robustness, making it suitable for demanding computing environments.
Applications for the K4X56323PN-8GC6 include computing systems, mobile devices, and other electronic products requiring high-performance memory integration. Its compatibility with various board architectures and adherence to international standards ensure reliable integration into diverse electronic designs.
| Qty | Low | High |
|---|---|---|
| 1+ | $1.28 | $1.28 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The K4X56323PN-8GC6 has a Ball Grid Array (BGA) package.
The standard package quantity is 76.
