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1,000 pcs
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1000 pcs | On Request | 1 | On Request | On Request | 1137+ | On Request | On Request |
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The Samsung Electronics K4X51163PI-EGC3 is a specialty memory integrated circuit (IC) designed for high-speed operation and reliable performance. It features a BGA (Ball Grid Array) package, which allows for efficient space utilization and heat dissipation, making it suitable for dense circuit board layouts.
This memory IC is optimized for fast data retrieval and storage, offering high data storage capacity and low power consumption. It is manufactured to high industry standards and undergoes rigorous testing to ensure performance stability and reliability.
The K4X51163PI-EGC3 is compatible with various electronic devices requiring high-speed memory solutions. Its applications include computing, mobile devices, and high-performance servers. The component is designed for long-term use with minimal degradation and utilizes eco-friendly materials and processes.
The K4X51163PI-EGC3 is a specialty memory IC.
The K4X51163PI-EGC3 uses a BGA package.
The K4X51163PI-EGC3 is used in computing, mobile devices, and high-performance servers.
The RoHS status is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.