| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
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111 pcs
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111 pcs | On Request | 1 | On Request | On Request | 23+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
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| Technology |
The K4X1G163PQ-FGC3 from Samsung Electronics is a Memory Integrated Circuit. This component is designed for various electronic applications requiring reliable memory storage.
Key specifications include RoHS compliance and a Moisture Sensitivity Level (MSL) of 1, indicating it is suitable for standard handling procedures. The part comes in an FBGA package, designed for surface mounting.
This memory IC is suitable for integration into a wide range of electronic devices. Its specifications suggest it is intended for applications where performance and reliability are critical. The lead time is typically 2-3 days after payment.
K4X1G163PQ-FGC3
Samsung Electronics
FBGA
Lead free / RoHS Compliant
1 Unlimited
2-3 days after payment.