| Distributor | Stock | Pricing | MOQ | PKG | Lead Time | Date Code | On Order Quantity | On Order Delivery | |
|---|---|---|---|---|---|---|---|---|---|
|
8,227 pcs
|
8227 pcs | On Request | 1 | On Request | On Request | 1252+ | On Request | On Request |
| Category | |
| Manufacturer Name | |
| Storage Temperature | |
| Tape & Reel |
The K4X1G163PE-FGD8 from Samsung Electronics is a memory component designed for various electronic applications. This part is specified as RoHS3 Compliant and has a Moisture Sensitivity Level (MSL) of 1, indicating unlimited shelf life under recommended storage conditions. The REACH status is noted as Unaffected.
This memory IC is housed in a BGA package, suitable for surface-mount designs. Further technical specifications such as operating voltage, operating temperature, memory size, interface type, data width, speed, organization, and supply voltage are not detailed in the available information and would typically be found in the manufacturer's datasheet.
This component is part of the broader category of memory devices. Its specific application context would depend on its detailed electrical characteristics, which are not fully provided here.
| Qty | Low | High |
|---|---|---|
| 1+ | $10.03 | $10.03 |
Estimated market price range - modelled values for guidance only, not live distributor offers.
The K4X1G163PE-FGD8 is RoHS3 Compliant.
The Moisture Sensitivity Level (MSL) is 1 Unlimited.
The package type is BGA.