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K4UBE3D4AA-MGCR The Samsung Electronics K4UBE3D4AA-MGCR is a 32Gbit DRAM with an LPDDR4X interface. It operates within a temperature range of -25℃ to +85℃ and comes in an FBGA-200 package.
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K4UBE3D4AA-MGCR

Available from 1 distributors
Mfr Name: Samsung Electronics
Samsung Electronics
The Samsung Electronics K4UBE3D4AA-MGCR is a 32Gbit DRAM with an LPDDR4X interface. It operates within a temperature range of -25℃ to +85℃ and comes in an FBGA-200 package.
✓ Total Stock: 1,842 pcs

K4UBE3D4AA-MGCR Available from 1 distributor

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1,842 pcs
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K4UBE3D4AA-MGCR Specifications Quick View

Most important parameters for selection – full specs in datasheet.
Category
Manufacturer Name
Interface
Memory Size
Mounting Type
Operating Temperature
Operating Voltage
SVHC Present
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K4UBE3D4AA-MGCR Description

Short technical summary and product information.

This Samsung Electronics K4UBE3D4AA-MGCR is a high-performance DRAM component with a substantial memory size of 32Gbit. It utilizes the LPDDR4X interface, offering efficient data transfer rates suitable for demanding applications.

 

The component is designed to operate reliably across a wide temperature range, from -25℃ to +85℃, making it versatile for various environmental conditions. Its packaging is specified as FBGA-200, indicating a Ball Grid Array form factor with 200 balls, typically used for surface-mount technology (SMT) assembly.

 

Key electrical specifications include a memory size of 32Gbit and support for multiple supply voltages (0.6V, 1.1V, 1.8V), ensuring compatibility with different system power requirements. The LPDDR4X interface is crucial for mobile and high-performance computing applications requiring low power consumption and high bandwidth.

 

This DRAM is suitable for integration into electronic devices where significant memory capacity and speed are essential. The FBGA-200 package requires specific SMT assembly processes.

K4UBE3D4AA-MGCR Quick Information

Product Type: DRAM
Canonical Name: Samsung Electronics K4UBE3D4AA-MGCR DRAM
Subcategory: DRAM

K4UBE3D4AA-MGCR Compliance

RoHS Status: RoHS Compliant
Moisture Sensitivity Level (MSL): 1 Unlimited
REACH Status: REACH Unaffected

K4UBE3D4AA-MGCR Features

  • 32Gbit memory size for ample storage.
  • LPDDR4X interface for high-speed data.
  • Wide operating temperature range: -25℃ to +85℃.
  • FBGA-200 package for surface mounting.
  • Multiple voltage support: 0.6V, 1.1V, 1.8V.

K4UBE3D4AA-MGCR Applications

  • Suitable for high-performance computing.
  • Ideal for mobile device memory needs.
  • Used in embedded systems requiring large RAM.
  • Applicable in data-intensive applications.

K4UBE3D4AA-MGCR FAQs

5 frequently asked questions generated from this part’s specifications.
What is the memory size of the K4UBE3D4AA-MGCR?

The memory size is 32Gbit.

What operating voltages does the K4UBE3D4AA-MGCR support?

It supports supply voltages of 0.6V, 1.1V, and 1.8V.

What is the operating temperature range for this DRAM?

The operating temperature range is -25℃ to +85℃.

What package type is the K4UBE3D4AA-MGCR?

It comes in an FBGA-200 package.

What interface does the K4UBE3D4AA-MGCR use?

It uses the LPDDR4X interface.

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